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Cutting
Accu-Glass provides a variety of cutting processes depending on your application. The Score Break method is economical because of the high speeds achieved and does not require special cleaning since it is a "dry cut" process. Tolerances achieved are generally +/- .010" for length , however tighter tolerance specifications can be achieved in some instances. The Precision wafer cutting process is used for applications where length and end cut requirements are more stringent. This method employs a gang arbor of stacked diamond cutting blades that are liquid cooled, with the product fixtured in a special CNC machine. This equipment was developed for the silicon waffering industry and has been modified to cut tubing and rod to very exact specifications. Common product tolerances for the length are in the range of +/- .002". After cutting, the parts are cleaned using ultrasonic techniques and then packaged to your requirement.
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QUALITY
